Web我们不断向先进的 cmos 的微缩和新存储技术的转型,导致半导体器件结构的日益复杂化。例如,在 3d nand 内存中,容量的扩展通过垂直堆栈层数的增加来实现,在保持平面缩放比例恒定的情况下,这带来了更高深宽比图形刻蚀工艺上的挑战,同时将更多的阶梯连接出来也更 … Web4 jan. 2024 · Our fabricated transistors with 40 nm fin width, LSD = 120 nm and LG = 90 nm exhibits an Ion ≈ 140 mA/mm, Ion/Ioff > 107, VTH = 1 V, SS = 150 mV/dec, gm,max = 14 mS/mm and Ron = 61 Ω∙mm. By precisely controlling the recess depth, enhancement-mode (E-mode) operation was also achieved.
Self-Aligned E-mode GaN p-Channel FinFET with ION > 100 mA/mm and ION ...
Web2015.bib @inproceedings{wu_theoretical_2015, title = {Theoretical study of the spontaneous electron-hole exciton condensates between n and p-type {MoS}2 monolayers, toward beyond {CMOS} applications}, doi = {10.1109/SISPAD.2015.7292274}, abstract = {We model equilibrium properties of possible room-temperature electron-hole exciton … Web5 nov. 2024 · The electrical performance of TFTs is evaluated from parameters as the saturation mobility (μsat), the TFT threshold voltage (Vth) and the on/off current … tsers formula
-MOSFETロバスト特性開発、ばらつき問題への取組み状況
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